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Please use this identifier to cite or link to this item: http://192.168.1.231:8080/dulieusoDIGITAL_123456789/18049
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dc.date.accessioned2020-12-21T14:35:29Z-
dc.date.available2020-12-21T14:35:29Z-
dc.date.issued2013-
dc.identifier.urihttps://www.sciencedirect.com/science/book/9781569905517-
dc.identifier.urihttp://192.168.1.231:8080/dulieusoDIGITAL_123456789/18049-
dc.publisherHanser-
dc.titleThree-Dimensional Molded Interconnect Devices (3D-MID)-
Appears in Collections:Kỹ thuật - Công nghệ

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