http://192.168.1.231:8080/dulieusoDIGITAL_123456789/18049| Title: | Three-Dimensional Molded Interconnect Devices (3D-MID) |
| Issue Date: | 2013 |
| Publisher: | Hanser |
| URI: | https://www.sciencedirect.com/science/book/9781569905517 http://192.168.1.231:8080/dulieusoDIGITAL_123456789/18049 |
| Appears in Collections: | Kỹ thuật - Công nghệ |
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